Identification code
AMD
AM25 S 05 D M
M: Temperature range (C=Commercial, M=military)
D: Package (D=Hermetic DIP, P=Molded, F=Flat, X=Dice)
05: Device number
S: Type (L=Low power, S=Schottky, LS=Low Power Schottky,
Blank=Standard)25: Functional group (25=MSI, 26=Computer Interface, 27=Bipolar
memory, 28=MOS, 90=MOS, 91=MOS)
American Microsystems (AMI)
S 6800X 2 P
P: Number of pins (see below)
2: Package type (see below)
X: Version
S: Family
pins/package: C=22 pin plastic or CERDIP
D=14 pin plastic or ceramic
F=12 pin TO
H=16 pin CERDIP, SLAM or ceramic
I=28 pin CERDIP or SLAM
L=24 pin CERDIP or SLAM
M=40 pin SLAM
P=18 pin plastic or CERDIP
T=40 pin plastic
U=16 pin plastic
W=24 pin plastic
Z=28 pin plastic
Fairchild
F 6800 AHM
M: Temperature (C=0° to 75°C
-40° to 85°C CMOS
L=-55° to 85°C MOS
-20° to 85°C Hybrid
M=-55° to 85°/125°C)H: Package (C=chip, Dice
D=CERDIP
E=Plastic Can
F=Flat Pac
H=Metal Can
J=Metal Power Package (TO-66)
K=Metal Power Package (TO-3)
P=Plastic DIP
R=Ceramic Mini DIP
T=Plastic Mini DIP
U=Power Package (Molded, TO-220)
W=Plastic (TO-92)F: Prefix (F=Fairchild, SH=Hybrid, uA=Linear)
M: Grade (Military, Industial, Q=commercial temperature range with burn-in
time of min. 160 h at 125 °C following guidelines in MIL-STD-883)
Harris
see Intel
Hughes Aircraft
H CTR 0320 D
D: Package (C=CERDIP, F=Flat Pack, P=Plastic DIP, T=TO)
CTR: Family (CTR=Counter
CUS=Custom
DSR=Dynamic Shift Register
SSR=Static Shift Register
SUB=Subsystem
MUL=Multiple
DIG=Discrete Insulated Gate
DGP=Discrete General Purpose
DSW=Discrete Switch
PLA=Programmable Logic Array)H: Prefix (H=Standard, S=Special)
Intel
M D 8080 A-3
A-3: version code + modifier for power, speed, processing etc.
8080: Device type (see table below)
D: Package type (C,D,P)
M: Grade (Military, Industial, Q=commercial temperature range with burn-in
time of min. 160 h at 125 °C following guidelines in MIL-STD-883)
Intel left the "C" prefix off the part number on C type packages when the chip was
only beeing made in the C type package. So a missing "C" prefix indicates that it
is a very early chip version. ==> see example Intel 8080Atable: Device Type, naming scheme
First Number = Product Family Second Number = Product Type number used for example used for example 0 Test chips n.a. Processors 4004, 4040 1 PMOS devices 1101, 1103 RAMs (static, dynamic) 3101, 2102 2 NMOS devices 2101, 2401 Controllers 2201, 8251 3 Bipolar devices 3101 ROMs 3301 4 4-bit microprocessors 4004, 4040 Shift registers 1406, 2401 5 CMOS devices 5101, 5201 EPLD 6 not used - PROM 1601 7 Bubble memory devices 7110 EPROM 1701, 1702 8 8-bit and beyond microprocessors and microcontollers 8008, 8080, 8085, 8086, 8088, 8048, 8051, 8096 Watch chips and timing circuits with oscillators 5801, 5810 9 not used - Telecommunications 2910, 2920
Intersil
I M 6100 CDL
L: Number of Pins (H=6, A=8, B=10, C=12, D=14, E=16, N=18,
F=22, G=24, I=28, J=32, K=36, L=40)D: Package (D=Dual.In-Line Package Ceramic
E=Small TO-8 type
F=Flat Package, Ceramic
G=TO-8 type
H=Flat Package, Silicon
I=16 pin DIP
J=Dual-In-Line CERDIP
L=Leadless Ceramic
P=Dual-In-Line Package, Plastic
T=TO-5 typeC: Temperature (C=Commercial 0° to 75°C
M=Military -55° to 125°C
N=Reduced Military -20° to 125°C)1: General type (0 to 4 Digital, 5=RAM, 6=PROM, 7=Shift Register)
6: Process (5=Bipolar, 6=CMOS, 7=MOS)
Mitsubishi
M 5 85 8086 S
S: Package (K=Glass-sealed Ceramic DIL
K-1=16 pin
P=Plastic-molded DIL
P-1=14 pin; JEDEC TO-116
P-3=16 pin
P-5=24 pin
P-11=8 pin
S=Metal-sealed Ceramic DIL
S-2=Metal-sealed CeramicDIL
Y=Can-sealed glass metal
Y-1=10 pin; modified JEDEC TO-3)85: Series (1, 17=Linear Circuit
3, 32, 33, 43, 44, 45, 46, 47=TTL
81, 85, 86=MOS
9=DTL)5: Temperature (5=Industrial / Commercial, 9=Military)
M: Mitsubishi
Mostek
MK 68000 P
P: Package (P=Gold side-brazed ceramic DIP
E=Ceramic leadless chip carrier
F=Flat Pack
J=CERDIP
K=Tin side-brazed ceramic DIP
N=Plastic
T=Ceramic DIP with transparent lid
W=Ceramic)MK: Mostek
MKB: 100 % 883B screening, with final electrical test at low, room
and high-rated temperatures.
Motorola
MC 68000 L
L: Package (F=Flat Ceramic Package
G=Metal Can Package, TO-5 types
K=Metal Power Package, TO-3 types
L=Ceramic Dual-In-Line Case
P=Plastic Package
PQ=IC´s Packaged in Staggered-Lead Plastic DIP Packages
R=Metal Power Packages, TO-66 types
U=Ceramic Package)MC: Packaged Integrated Circuits
NEC
uP D 8086 D -XX
XX: speed version
D: Package (C=Plastic, D=Ceramic, CT=Plastic Shrink,
CX=Plastic Skinny, G=Plastic SO, GB/GC/GF=
Plastic Flat Pack, L=PLCC, R=PGA)D: Family (A=Discrete
B=Digital Bipolar
C=Linear
D=Digital CMOS)uP: Micropackage
RCA
CDP 1802 B D
D: Package (D=White Ceramic DIP
E=Plastic DIP
F=Ceramic DIP, frit seal
G=Hermetic Chip in Plastic Package
H=Chip
K=Ceramic Flat Package
L=Beam-Lead Device
Q=Quad-I-Line Plastic Package)
S=TO-5 Package with DIL-CAN
T=TO-5 Package
X=Ceramic DIP, frit sealB: Version (A=Modified version, unilaterally interchangeable
with Prototype
B=Modified version, unilaterally interchangeable
with A-version and with Prototype
C=Modified version, unilaterally interchangeable
with A- and B-version and with Prototype)CDP: Prefix (CA=Linear IC´s
CD=Digital IC´s
CDP=Microprocessor IC´s
MW=MOS IC´s
CDPS=SOS versions
MWS=SOS versions
Robotron
U B 8820 D
D: package type (D=DIP, M=ZIP)
0: option (0= oscillator possible, 1=power down possible)
2: ROM (1=internal ROM, 2=external ROM,
3=internal ROM with basic interpreter)B: clock frequency (B=8 MHz, D= 3.6 MHz)
Signetics
N 3002 I
I: Package (N=8, 14, 16, 18, 22, 24, 28, 40 Lead DIL Plastic
F=14, 16, 18, 22, 24 Lead Ceramic DIP
I=8, 14, 16, 18, 22, 24, 28, 40, 50 Lead Ceramic DIP
Side Brazed
W=10, 14, 16, 24 Lead Ceramic Flat Pack
Q=10, 14, 16, 24 Lead Ceramic Flat-Bottom Brazed
K=10 Lead TO-100 Header, Low Profile
T=10 Lead TO-100 Header Tall Can
L=8 Lead TO-99 Header
DA=TO-3 Solid Header, Can
DB=TO-5 Solid Header, Can
R=16, 18, 24, 28, 40 Lead Beryllia Flat Pack)N: Temperature (M=Linear IC-Alternate Source
N or None=0° to 70°C
N8=0° to 75°C
S(E)=-55° to 125°C
SA=-40° to 85°C
5400 Series=-55° to 125°C
7400 Series=0° to 70°C)
Texas Instruments
TMS 9900 JL
L: Temperature (C=-125° to 85°C
L=0° to 70°C
R=-55° to 85°C)J: Package (FA=Flat Package
J=Ceramic Flat Package
JA=DIP
JB=DIP
JP=DIP
L=Metal Can
LA=Metal Can
N=Plastic DIP
ND=Plastic DIP with Tab
P=Plastic DIP
RA=Flat Package
SB=Flat Package
T=Metal Flat Package
W=Ceramic Flat PackageTMS: Family (RSN=Radiation Hardened Circuit
SBP=Bipolar Processor
SN=Standard Prefix
SNM=High Reliability, Level I
SNA=High Reliability, Level II
SNC=High Reliability, Level III
SNH=High Reliability, Level IV
TL=Linear
TMS=MOS
Toshiba
TA 8086 P
P: Package (P=Plastic, M=Metal, A=Improved Type)
TA: Family (TA=Bipolar Linear
TC=CMOS
TD=Bipolar Digital
TM=MOS)
Western Digital
TR 1602 A 01
01: Special Parameter
A: Package (A=40 Lead DIP, Ceramic
B=40 Lead DIP, Plastic
C=24 Lead DIP, Ceramic
D=24 Lead DIP, Plastic
E=28 Lead DIP, Ceramic
F=28 Lead DIP, Plastic
G=22 Lead DIP, Ceramic
H=22 Lead DIP, Ceramic)
